Cannon Technologies announces new Polyrack electronic packaging catalogue
Cannon Electronic Packaging (CEP) part of the award winning Cannon Technologies Group, has announced the availability of a new catalogue featuring the entire range of standard and customised electronic packaging solutions from Polyrack Tech-Group.
The publication of this comprehensive 728 page catalogue follows the announcement earlier this year of a landmark distribution agreement between the two industry leaders, which allows CEP to exclusively supply Polyrack’s diverse range of subracks, cases, system desktop and rack-mount products, microcomputer packaging, industrial PC applications, PC panel systems, thermoplastic injection moulded components and plug-in-modules to its customers across the UK and Ireland.
These products are used extensively within the communications, broadcast, security and defence, transportation, utilities and medical sectors, as well as in a wide range of test and measurement environments. Over 40 individual products are profiled in the catalogue and with each one available in a number of different sizes, and complemented by a range of accessories, it makes in excess of 600 lines. Andreas Rapp, CEO of the Polyrack Tech-Group, stated, ‘Having all of our products and services in one catalogue impressively displays the manufacturing capabilities we possess and the various options available to CEP’s customers. All of the standard ranges can be fully customised and designed to meet individual requirements, with most products available from stock via the European distribution centre.
Taking centre stage in the catalogue is Polyrack‘s new EmbedTEC enclosure range. Offering an unrivalled degree of flexibility in its dimensions and parameters, EmbedTEC has been primarily developed for embedded computing and human machine interfaces (HMI), but can be utilised within a number of diverse applications. Its design features a basic plate, four corner elements and a cover. The basic plate and the cover can be modified for mounting of components or extension elements, for example, the construction of the latter allows for the integration of a heat sink and enhanced shielding components can be added as required.
Also featured is the series of compact PCI (cPCI) embedded computing systems, which allows designers and integrators to take advantage of an industry leading product that boasts in-built flexibility to meet any unique challenge. One size rarely fits all, which is why Polyrack’s design team can also assist with special design requirements such as backplane design, power, thermal management, RFI/EMI, cabling and wiring and system management. In addition, aesthetic features such as custom colours or silk-screening can be incorporated to put a unique finishing touch to a system.
‘The response to our strategic partnership with Polyrack has exceed all expectations,’ commented CEP’s director of business development, Glenn Conlon. ‘There is clear demand from our customer base for best in class electronic packaging solutions and the new catalogue makes it easier than ever to find the right product for a particular application.’
To request a free copy of the Polyrack catalogue call Cannon Technologies on +44(0)1425 632600, or send an email to firstname.lastname@example.org
For more information visit www.cannontech.co.uk/electronic_packaging.html
ABOUT CANNON TECHNOLOGIES
With a 36-year pedigree, Cannon Technologies provides T4 Data Centre Solutions around the globe – from turnkey data-centre projects up to TIA 942 Tier 4 to suites of intelligent, environmentally managed infrastructure racks, including cold-aisle cocooning, per-rack access control, video surveillance, intelligent power distribution and UPSs. At a top turnkey level Cannon designs, supplies, integrates and commissions the ‘IT’ architecture for military and commercial applications, for mission-critical projects.
ABOUT CANNON ELECTRONONIC PACKAGING (CEP)
CEP is a manufacturer, supplier and leading partner of electronic packaging products for the electronic packaging and embedded systems market — from components, subracks, case, backplanes, chassis and embedded systems to fully integrated subsystems. To support CEP’s global customer the company has subsidiaries in five countries on three continents. To ensure their integrated solutions are optimised to their customer’s needs, CEP partners with leading electronic packaging and embedded systems manufactures in the industry. CEP also provides enclosure solutions to electronics companies, from cases to vertical cabinets, as well as precision components such as castings, injections mouldings and front panels. The company has a broad base of proven standard products that can be tailored to individual applications, from initial concept to volume production. CEP’s reliable solutions, flexibility, and design expertise are key reasons why leading electronics companies choose Cannon Electronic packaging time and again.