Home Page ContentPress Releases Inside Cisco’s Material Science and Failure Analysis Lab

Inside Cisco’s Material Science and Failure Analysis Lab

by david.nunes

Inside Cisco’s Material Science and Failure Analysis Lab

DID YOU KNOW diagnostic engineers can look inside a memory chip and analyze metal joints that are thinner than a single strand of hair? #discovercisco

Karen Crocker Snell

July 28 , 2014

In Cisco’s Material Science and Failure Analysis Lab, a team of engineers works with suppliers and product development teams across the company to find answers and solve problems in every stage of a product’s life cycle – from prototyping to manufacturing.

Non-destructive physical analysis of a single memory chip can be done with a sonar-like scanning acoustic microscope where the memory chip is submerged in water. The specialized microscope allows a diagnostic engineer to look deep inside a component.

LAB photo Box

Having the ability to see the innards of a component’s bits and bytes, can give engineers the answers they need to perfect a product.

LAB photo Box

Equipment like this scanning electron microscope allows engineers to conduct joint analysis on the solder joint metals used to mount multiple silicon chip components, like a memory chip, onto a single package.

LAB photo Box

With this high-powered microscope, engineers are able to dissect a single joint that measures just 30 microns in width, that is thinner than a single strand of hair. With this data they can better understand how a component is constructed and what problems may arise.

If a problem does arise, in this lab, no piece of the puzzle is too small to help solve it.

Related Tags: Leadership , Did You Know

Related Articles

This website uses cookies to improve your experience. We'll assume you're ok with this, but you can opt-out if you wish. Accept Read More