Qualcomm Introduces New Snapdragon 700 Mobile Platform Series
— New Series Designed to Allow Global OEMs to Deliver Premium Features, such as On-Device Artificial Intelligence, in High-Tier Smartphones and Meet Ever-Increasing Demands of the China Smartphone Ecosystem for More Premium Devices —
BARCELONA, SPAIN — February 27, 2018 — Qualcomm Incorporated (NASDAQ:QCOM) announced that its subsidiary, Qualcomm Technologies, Inc., has introduced the new Qualcomm® Snapdragon™ 700 Mobile Platform Series, designed to exceed what is expected from today’s high-tier mobile experiences, with features and performance previously only available in the premium Snapdragon 800 Mobile Platform Series. Advances to be expected in the 700 Series include on-device AI supported by the Qualcomm® Artificial Intelligence (AI) Engine, and improvements to camera, device performance and power, supported by the heterogeneous compute power of premium features including the Qualcomm Spectra™ ISP, Qualcomm® Kryo™ CPU, Qualcomm® Hexagon™ Vector Processor and Qualcomm® Adreno™ Visual Processing subsystem.
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— New Highly Integrated and Optimized 5G Modules Designed to Support Faster Time to Market Through Simplifying end Device Designs, Reducing System Complexity and Lowering Entry Barriers for OEMs—
BARCELONA, SPAIN — February 27, 2018 — Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), today announced the launch of its Qualcomm® Snapdragon™ 5G Module Solutions engineered to support original equipment manufacturers (OEMs) looking to capitalize on 5G technologies with an easy path to commercialize 5G in smartphones and major verticals quickly. By aggregating the most fundamental components of 5G into simple modules, Qualcomm Technologies aims to simplify end device designs, lowers total cost of ownership and support faster time to commercialization to ultimately accelerate new OEM entrants’ ability to adopt 5G in their systems.
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— RFFE Suite, Snapdragon 845 and X20 LTE Together Designed for Superior Connectivity, Power Efficiency and Device Performance —
BARCELONA, SPAIN — February 27, 2018 — Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), today announced that ASUS will feature the entire Qualcomm® RF Front End (RFFE) modem-to-antenna solution along with the Qualcomm® Snapdragon™ 845 Mobile Platform with X20 Gigabit LTE modem in their upcoming premium smartphone as well as their “Always Connected” PC Devices, powered by the Snapdragon Mobile PC platform. ASUS is the latest leading device manufacturer to utilize Qualcomm Technologies’ comprehensive modem-to-antenna solution in its devices. By utilizing the Qualcomm RFFE suite, ASUS will benefit from system-level optimization designed to deliver superior connectivity and the long battery life needed to support super-fast data speeds. Additionally, the integration of Qualcomm Technologies’ modem-to-antenna solution will bring support for powerful and compelling mobile computing experience with always on connectivity to ASUS’ upcoming Windows 10 device.
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— Latest Technology Designed to Support Complex Carrier Aggregation Combinations in Multiple, Diverse RF Bands for Improved Performance —
BARCELONA, SPAIN — February 27, 2018 — Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), and RF360 Holdings Singapore PTE. Ltd. (RF360 Holdings) a Qualcomm and TDK Joint Venture are the first to announce a hexaplexer RF solution that incorporates their latest bulk acoustic wave (BAW) and surface acoustic wave (SAW) filter technologies to support optimal performance, size and cost for increasingly complex frequency band combinations. The new hexaplexer solution complements our product line of filters, duplexers, and multiplexers, by addressing diverse carrier aggregation configurations that operators have been deploying to enhance user experience as they expand Gigabit LTE coverage, speed and capacity. The new solution can benefit original equipment manufacturers (OEMs) by simplifying carrier aggregation support in Qualcomm Technologies’ power amplifier modules, thereby improving size and cost efficiency of design and helping accelerate time to global launch. For consumers, the low insertion loss of the hexaplexer solution is designed to support long battery life and superior data rates.
