New M5730 two-chip modem consumes half the power of existing HSPA+ 21Mbps solutions
Geneva, Switzerland, October 6, 2010 – ST-Ericsson, a world leader in wireless platforms and semiconductors, is launching an extremely power-efficient and compact HSPA+ modem capable of transmitting data at speeds of up to 21Mbps. With up to fifty per cent lower power consumption than competing HSPA+ 21Mbps modems available on the market, the highly-integrated M5730 will enable ST-Ericsson’s customers to produce small, affordable and power-efficient HSPA+ smartphones, USB-dongles and embedded modules.
Mobile devices equipped with the M5730 modem, which is already being sampled by customers, will be able to offer up to double the high-speed Internet browsing time of mobile devices using other HSPA+ 21Mbps modems.
“We have made a breakthrough in HSPA+ modem engineering that is enabling our customers to produce sleek devices offering both high transmission speeds and long battery lives,” said Magnus Hansson, Senior Vice President and head of LTE and 3G Modem Solutions division at ST-Ericsson. “We anticipate seeing smartphones and other connected devices based on our new HSPA+ modem shipping in early 2011, enabling consumers and business people to spend more time surfing the Internet at high-speeds and less time worrying about power adaptors and sockets.”
ST-Ericsson’s M5730 is the world’s first two-chip 21Mbps modem and the smallest HSPA+ 21Mbps solution to date. Using just two chips makes the M5730 very compact, reducing the bill of materials for device manufacturers. It also has exceptionally low-levels of heat dissipation enabling it to be embedded in a very wide range of devices.
The M5730 makes use of the 64-QAM advanced modulation technique, providing end-users with higher average throughput speeds and enabling mobile operators to make more efficient use of their spectrum. ST-Ericsson’s field tests with mobile operators found the use of 64-QAM technology results in an average 30 percent increase in spectral efficiency.
