Home Page ContentPress Releases TE Connectivity, SAP, ifm and the OPC Foundation Announce New IIC Testbed on Sensor-to-the-Cloud Connectivity

TE Connectivity, SAP, ifm and the OPC Foundation Announce New IIC Testbed on Sensor-to-the-Cloud Connectivity

by david.nunes

TE Connectivity, SAP, ifm and the OPC Foundation Announce New IIC Testbed on Sensor-to-the-Cloud Connectivity

“Smart Manufacturing Connectivity for Brownfield Sensors” Testbed approved by the Industrial Internet Consortium enables easy integration of sensors with IT systems in existing facilities

DARMSTADT, Germany – August 25, 2016 – TE Connectivity (TE), a world leader in connectivity and sensors takes a leading role in a research testbed. The Industrial Internet Consortium® (IIC) has approved an IIC testbed on sensor-to-the-cloud connectivity called the Smart Manufacturing Connectivity for Brownfield Sensors Testbed. This testbed is being carried out with fellow IIC members SAP, ifm, and the OPC foundation. The idea for the testbed was publicly unveiled at the Hanover Fair in April of this year.

The objective of sensor-to-the-cloud connectivity is to make sensor data available to information technology (IT) systems in near real time, enabling advanced analytics. This is of particular interest to operators of existing manufacturing facilities, as it provides them with opportunities to increase efficiencies through reductions in energy consumption. Unlike new deployments, where the appropriate connectivity may be designed in from the beginning, smart solutions are required for these “brownfield” installations in order to enable easy integration at boththe operational technology (OT) and the IT level to reduce downtime and save costs.

“Working with partners within the IIC, TE has once again demonstrated its expertise in the field of intelligent solutions for future industrial data communications,” says Ulrich Wallenhorst, vice president & chief technology officer, Business Development & Strategy at TE. “This testbed is an excellent demonstration of how our smart technology can be used to connect devices, sensors and communication architectures that exist at different levels in existing industrial infrastructures to ensure a smooth flow of information from the field to the cloud and to enable data analytics.”

The Smart Manufacturing Connectivity for Brownfield Sensors Testbed will:

·         Introduce a retrofit hardware solution (the “Y-Gateway”) that makes use of existing physical connectivity

·         Extract sensor data from the automation system without impacting operations

·         Deliver the sensor data to SAP’s IT platform through a secure OT/IT communication based on OPC UA (IEC 62541)

·         Define and implement a common device model based on an available open standard to allow for the easy integration of an IO-Link sensor with IT, enabling the remote configuration of the sensor

“Testbeds are a major focus and activity of the IIC and its members”, saidIIC Executive Director, Dr. Richard Soley. “Our testbeds are wherenew technologies, applications, products, services and processes – the innovation and opportunities of the industrial Internet – can be initiated, thought through and rigorously tested to ascertain their usefulness and viability before coming to market.”

TE Connectivity and the TE connectivity (logo) are trademarks of the TE Connectivity Ltd. family of companies. Other logos, product or company names mentioned herein may be trademarks of their respective owners.


TE Connectivity (NYSE: TEL) is a $12 billion global technology leader. Our connectivity and sensor solutions are essential in today’s increasingly connected world. We collaborate with engineers to transform their concepts into creations – redefining what’s possible using intelligent, efficient and high-performing TE products and solutions proven in harsh environments. Our 72,000 people, including 7,000 design engineers, partner with customers in close to 150 countries across a wide range of industries. We believe EVERY CONNECTION COUNTS – www.TE.com.

ABOUT Industrial Internet Consortium

The Industrial Internet Consortium is an open membership organization with over 240 members from 30 countries, formed to accelerate the development, adoption and wide-spread use of interconnected machines and devices, intelligent analytics and people at work. Founded by AT&T, Cisco, General Electric, IBM, and Intel in March 2014, the Industrial Internet Consortium catalyzes and coordinates the priorities and enabling technologies of the Industrial Internet. The Industrial Internet Consortium is managed by the Object Management Group® (OMG®). For more information, visit www.iiconsortium.org.

To learn more about the Smart Manufacturing Connectivity for Brownfield Sensors Testbed, visit http://www.iiconsortium.org/smart-connectivity.htm.


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