Tianyu Ventures in to SiC Epitaxial Business for SiC Power Device on a Global Scale
DONGGUAN, China, Sept. 3, 2012 — Dongguan Tianyu Semiconductor Technology Co., Ltd. (Tianyu), the first SiC epitaxial wafer company in China, has started to expand its SiC epitaxial wafer business globally after the completion of three contracts prior to this in August 2012.
“The prospects of the SiC are bright,” said Li Xiguang, GM of Tianyu. “SiC substrate is getting better, larger and cheaper; more attention is paid on this market. SiC device will show more competitiveness in the global market.” SiC device will be netting a billion dollars in a decade according to a market analyst of Yole Developpement.
SiC epitaxial wafers are used in producing Schottky diodes, MOSFETs, JFETs, and BJTs over a wide voltage range and customized wafers for thyristors, GTOs and IGBTs over a wider voltage range for medium to very high voltage power conversion system applications. These devices are used for energy efficient power electronic devices for numerous applications, such as air-conditioning, solar and wind turbine inverters, hybrid and electric vehicles, high speed trains, smart grids and high-voltage DC power transmission. SiC-based semiconductor devices can reduce energy losses and system size, leading to overall reduced system costs and enhanced reliability.
Dongguan Tianyu Semiconductor Technology Co., Ltd. (Tianyu), which was founded on Jan. 7th, 2009, and located in Songshan Lake National High-tech Industrial Development Zone of Dongguan City in Guangdong province, is the first high-tech company specializing in research, production and marketing the third generation semiconductor silicon carbide (SiC) epi-wafers in China.
Tianyu facilities cover 20000 square meters in plant areas, and 10000 square meters in workshop. Two world-class SiC CVD reactors and auxiliary inspection equipments such as AFM from Bruker, Mercury Probe Tester from Semilab, KLA-Tensor and thickness test system were introduced in the production of the SiC epi-wafer in Tianyu.
Tianyu has a top-ranking technical team, Chinese Academy of Sciences, six major researchers and 30 engineers working on the SiC epitaxial technology growth. The epitaxial wafer size includes 4″, 3″, and 2″. Production capacity is 10000 pcs/month, which can be increased if needed, and product specifications reach the advanced level in international standards.
For more information about Tianyu and its products, please visit http://www.sicty.com.