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Toshiba Debuts Flashmatrix Technology at 2016 Flash Memory Summit

by david.nunes

Toshiba Debuts Flashmatrix™ Technology at 2016 Flash Memory Summit

New ‘big data’ analytic platform tool features a unique, all-flash, compute-centric architecture

Düsseldorf, Germany, 8th August, 2016 – Toshiba Electronics Europe (TEE) has announced Flashmatrix™, a new, all-flash, big data analytic platform technology. Flashmatrix is well suited for the growing need for real time/streaming analytics in distributed systems targeted at high data intensive applications in manufacturing, finance, medical and security. Toshiba will debut the technology at this week’s 2016 Flash Memory Summit in Santa Clara, USA.

This new breed of Superconverged infrastructure features integrated compute, storage and network elements optimized for high performance. With its unique architecture of NAND flash memory arranged in a matrix, Flashmatrix enables multiple data sets to be accessed in parallel and scaled linearly. All of the NAND flash memory is shared by every CPU allowing for flexibility and high performance. The entire platform is in a 2U enclosure and offers linear rack scale scalability. Flashmatrix is optimally designed for low power consumption.

“Big data processing can face multiple problems in scaling, latency and power as the customer demands increase,” said Paul Rowan, General Manager of Toshiba Electronics Europe, SSD Business Unit. “Flashmatrix addresses each of those issues to create a system that is a true solution for analytic processing by offering low-power-consumption, parallel processing to reduce system latency, card level scaling and a large non-volatile memory space shared by all CPUs.  Flashmatrix continues Toshiba’s mission to persistently develop innovative technologies to make the best use of NAND flash memory.”

Toshiba will showcase Flashmatrix at booth 407 at the 2016 Flash Memory Summit, taking place August 9-11 in Santa Clara, California. Toshiba’s Shigeo (Jeff) Ohshima, Technology Executive, Memory Design and Application Engineering, and Yoichiro Tanaka, Sr. Fellow, will also be keynoting at the Flash Memory Summit with their presentation, “New 3D Flash Technologies Offer Both Low Cost and Low Power Solutions,’ on Tuesday, August 9th from noon – 12:30 p.m. PT.

Toshiba Electronics Europe (TEE) is the European electronic components business of Toshiba Corporation, which is ranked among the world’s largest semiconductor vendors. TEE offers one of the industry’s broadest IC and discrete product lines including high-end memory, microcontrollers, ASICs and ASSPs for automotive, multimedia, industrial, telecoms and networking applications. The company also has a wide range of power semiconductor solutions as well as storage products including HDDs, SSDs, SD Cards and USB sticks.

TEE was formed in 1973 in Neuss, Germany, providing design, manufacturing, marketing and sales and now has headquarters in Düsseldorf, Germany, with branch offices in France, Italy, Spain, Sweden and the United Kingdom. TEE employs approximately 300 people in Europe. Company president is Mr. Akira Morinaga.


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