Mobile World Congress 2012, 27th February – 1st March
Hall 7, Stand 7D22
Toshiba Demonstrates TransferJetTM Close Proximity Wireless Transfer Technology
Demo of industry’s first single-chip TransferJet solution on Consortium’s Booth
Duesseldorf, Germany, 8th February 2012 –Toshiba Electronics Europe (TEE) will be offering visitors to the TransferJet™ Consortium’s booth at Mobile World Congress the opportunity of a hands-on demonstration of this high-speed, close-proximity wireless transfer technology built around the company’s advanced TC35420 wireless IC.
Billed as the industry’s first single-chip TransferJet solution, the TC35420 integrates all of the host interface, modem, baseband and RF functions necessary for TransferJet communications. An advanced 65nm RF-CMOS process has minimised the requirement for external RF circuits and peripheral components and is the key to typical dimensions of just 4mm x 4mm x 0.5mm. A very high receiving sensitivity of -78dBm ensures stable communication between TransferJetTM-compliant digital devices.
Toshiba’s demonstration will appear alongside other TransferJet Consortium members’ system solutions for ultra-fast wireless data exchange in applications ranging from tablets, mobile phones and digital cameras to video kiosks and digital signage.
TransferJet™is a close proximity wireless transfer technology standard promoted by the TransferJet Consortium whose membership consists of 53 companies (as of September 2011), including Toshiba. TransferJet provides high-speed data transfer with low-power consumption simply by selecting on the screen of a device the data file to be transferred through close proximity or by touching two devices together. It was designed to facilitate the rapid transfer of large files, such as pictures or HD videos, between devices by download or streaming and can take place between two portable devices or between a portable device and a stationary PC, peripheral, or TV incorporating TransferJet technology.”
Toshiba Electronics Europe (TEE) is the European electronic components business of Toshiba Corporation, which is ranked among the world’s largest semiconductor vendors. TEE offers one of the industry’s broadest IC and discrete product lines including high-end memory, microcontrollers, ASICs, ASSPs and display products for automotive, multimedia, industrial, telecoms and networking applications. The company also has a wide range of power semiconductor solutions. TEE was formed in 1973 in Neuss, Germany, providing design, manufacturing, marketing and sales and now has headquarters in Düsseldorf, Germany, with subsidiaries in France, Italy, Spain, Sweden and the United Kingdom. TEE employs approximately 300 people in Europe. Company president is Mr. Takashi Nagasawa.
Toshiba Corporation is a world leader and innovator in pioneering high technology, a diversified manufacturer and marketer of advanced electronic and electrical products spanning digital consumer products; electronic devices and components; power systems, including nuclear energy; industrial and social infrastructure systems; and home appliances. Founded in 1875, Toshiba today operates a global network of more than 490 companies, with 203,000 employees worldwide and annual sales surpassing US$77 billion.
For more information visit Toshiba Electronics Europe’s web site at www.toshiba-components.com
Contact details for publication:
Toshiba Electronics Europe, Hansaallee 181, D-40549 Düsseldorf, Germany
Tel: +49 (0) 211 5296 0 Fax: +49 (0) 211 5296 792197
Contact details for editorial enquiries:
Henning Rausch, Toshiba Electronics Europe
Tel: +49 (211) 5296 117